CMOS gate structure polymer

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Uploaded: 13.03.2009
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Development of technology for the manufacture of IC based on the CMOS structures with poly-silicon gate
TABLE OF CONTENTS

Introduction ................................................................................. ..3

1 Design of CMOS transistors with polysilicon ЗА-ТВОРОМ…………………………………………………………………………..4

2 Overview of modern technical solutions chip production .............................................................................. .5
2.1 Operations lithography ...................................................... ..5
2.1.1 Drying resist ............................................................ ... 7
2.1.2 The combination of drawing template .......................................... 9
2.1.3 exposure and development .......................................... 9
2.1.4 Etching .................................................................. 10
2.2 Types of lithography ............................................................ .17
2.2.1 Photolithography ......................................................... ..17
2.2.1.1 Contact lithography ............................................. .17
2.2.1.2 projection lithography .......................................... 17
2.2.1.3 Holographic lithography .................................... ... 19
2.2.2 X-ray lithography ............................................. .20
2.2.3 Electronic lithography ................................................ 23
2.2.4 Ion-beam lithography ............................................. 26
2.3 Methods of diffusion ......................................................... ... 26
2.3.1 Thermal diffusion ................................................ ..26
2.3.2 Ion implantation ................................................... ..30
2.4 Application of thin dielectric films ........................... .32
2.4.1 Thermal oxidation ................................................ ..32
2.4.2 PECVD oxide ..................... .33
2.4.3 Chemical vapor deposition ........................... ..33
2.5 Application of metal films ....................................... ..34
2.5.1 Method of thermal vacuum deposition ................................. .34
2.5.2 The method of ion-plasma sputtering .............................. 35

3 sequence of technological operations in CMOS production with a polysilicon ЗАТВО-РАМИ……………………………………………………………………………..36

CONCLUSIONS ........................................................................... .40

LIST OF USED LITERATURE .................................... ... 41

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