The technology of manufacture of printed circuit boards

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Uploaded: 13.01.2010
Content: 00113035925950.djvu 962,13 kB

Product description

The main methods of manufacturing printed circuit boards of various designs including multi-platy.Predstavleny basic information on technological processes of production of printed circuit boards based on advanced achievements of domestic enterprises for the production of printed circuit boards subtractive and additive methods.

Additional information

I. Processes PCB production
1. Purpose and methods of manufacture of printed circuit boards
2. The chemical method of manufacturing boards
3. An electrochemical method for producing printed circuit boards
4. Combined method of manufacturing boards
5. The additive method of making boards
II. Machining processes in manufacturing boards
6. Preparation of blanks
7. Drill holes to be metallization
8. Stamping operations and processing on a contour
III. Chemical plating
9. The theoretical foundations of the chemical copper plating
10. Activation of the surface
11. The electroless plating solutions
IV. Getting protective relief
12. The method of creating the protective relief
13. Liquid photoresists
14. The dry film photoresist
15. Setkografnya
V. galvanic processes
16. The copper plating
17. The protective coating tin-lead alloy (PIC-60)
18. Finishing of connector PCB
19. Clarification and melt coating tin-lead
VI. Etching of copper
20. The solutions based on ferric chloride n persulfate
21. Chlor-copper acidic and alkaline solutions


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